NXP Semiconductors
BAP64-02
Silicon PIN diode
Legal information
Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “De?nitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL
http://www.nxp.com.
De?nitions
Draft —
The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modi?cations or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet —
A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
of?ce. In case of any inconsistency or con?ict with the short data sheet, the
full data sheet shall prevail.
Disclaimers
General —
Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes —
NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation speci?cations and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use —
NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications —
Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
speci?ed use without further testing or modi?cation.
Limiting values —
Stress above one or more limiting values (as de?ned in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale —
NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at
http://www.nxp.com/pro?
le/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or con?ict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license —
Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Contact information
For additional information, please visit:
http://www.nxp.com
For sales of?ce addresses, send an email to:
salesaddresses@nxp.com
Document status[1][2]
Product status[3]
De?nition
Objective [short] data sheet Development This document contains data from the objective speci?cation for product development.
Preliminary [short] data sheet Quali?cation This document contains data from the preliminary speci?cation.
Product [short] data sheet Production This document contains the product speci?cation.
Rev. 06 - 9 January 2008
6 of 7
发布紧急采购，3分钟左右您将得到回复。
相关PDF资料
BAP64-04W,115
DIODE PIN 100V 100MA SOT-323
BAP65-02,115
DIODE PIN 30V 100MA SOD-523
BAR43C
DIODE SCHOTTKY 30V 200MA SOT23
BAR43S
DIODE SCHOTTK 30V 200MA SOT23
BAS116UDJ-7
DIODE ARRAY 85V 215MA SOT963
BAS116V-7
DIODE LL 150MW 85V SOT-563
BAS16DXV6T1G
DIODE SWITCH DUAL 75V SOT563
BAS16V-7
DIODE SWITCH 75V 150MW SOT-563
相关代理商/技术参数
BAP64-02115
制造商:NXP Semiconductors 功能描述:DIODE PIN 175V 0.1A SOD-523 制造商:NXP Semiconductors 功能描述:SILICON PIN DIODE
BAP64-03
制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Silicon PIN diode
BAP64-03,115
功能描述:PIN 二极管 PIN 175V 100MA RoHS:否 制造商:Skyworks Solutions, Inc. 配置: 反向电压:200 V 正向连续电流: 频率范围:10 MHz to 6 GHz 端接类型:SMD/SMT 封装 / 箱体:QFN-3 封装:Reel
BAP64-03115
制造商:NXP Semiconductors 功能描述:DIODE PIN 175V 0.1A SOD-323
BAP6404
制造商:PHILIPS 功能描述:New
BAP64-04
制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Silicon PIN diode
BAP64-04,215
功能描述:PIN 二极管 PIN 175V 100MA RoHS:否 制造商:Skyworks Solutions, Inc. 配置: 反向电压:200 V 正向连续电流: 频率范围:10 MHz to 6 GHz 端接类型:SMD/SMT 封装 / 箱体:QFN-3 封装:Reel
BAP64-04W
制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Silicon PIN diode